VIA launches Cyrix 650 MHz & 667 MHz CPUs

VIA Technologies, a leading supplier of PC core logic chipsets internationally, has launched its new generation, high-performance VIA Cyrix III processors of 650 MHz and 667 MHz in the Indian market. The company has appointed Karma Distribution as master distributor in the country. Karma has in-turn selected eight import partners for marketing these products in over 50 cities. Chennai-based Wellwin Industry is one of the import partners for Karma.

The principle company will be launching Box CPUs and 1 GHz processors in the market, shortly.

"We are focussing mainly on OEM partners and system integrators (SI) to promote the products and we have well-positioned our processors in the sub Rs 25,000 PCs category. Talks are on with PC manufacturers like HCL, Wipro and Vintron to supply our CPUs as an OEM partner, and some are in the advanced stages of negotiations," said Anshuman Gupta, Manager - Marketing, Karma Distribution (S) Pte Ltd.

Built using an advanced 0.18 micron manufacturing process, the two new processors feature a 128KB Level 1 cache and support for a 100/133MHz Front Side Bus to ensure robust performance for high productivity and Internet applications.

The processors are targeted at the rapidly growing educational and Internet value PC segment, besides on the corporate sector. "We hope to get over 20 percent market share in the next one year, in line with the VIA Technologies' global marketing strategy," said Richard Brown, Director - International Marketing, VIA Technologies Inc.

"These are the company's high-speed processors, yet for the value PC market. We are very conscious of getting good margins for our channel partners and at the same time, provide a quality solution for value conscious consumers and businesses," said Brown.

The company claims that the products have an edge over its competitors in price and features. The processors are `Socket 370 Compatible' meeting the industry standards and offering high flexibility for any changes in future, if any. "We are offering low-power consumption and low-heat emitting products, also it's smaller in size and high-speed in performance," quipped Brown. Currently, VIA Technologies is working on 0.15 and 0.13 micron manufacturing technology, and the products are to be released based on this technology in the coming months.

"We have outlined various promotion scheme for system integrators to aggressively market the product," said Gupta.