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MediaTek has introduced the Dimensity 9400+ system-on-chip (SoC), the latest model in its Dimensity flagship chipset series. Designed for improved generative and agentic AI performance, the Dimensity 9400+ also offers support for advanced large language models (LLMs) while maintaining a power-efficient architecture.
The SoC is built on an all-Big Core design, incorporating one Arm Cortex-X925 core with a clock speed of up to 3.73 GHz, along with three Cortex-X4 cores and four Cortex-A720 cores. This configuration is aimed at boosting both single-threaded and multithreaded performance, enhancing the user experience across high-end Android devices.
“The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalised AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease,” said JC Hsu, Corporate SVP at MediaTek. “We are working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring several speed and privacy benefits to consumers.”
Features of the Dimensity 9400+
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Phone-to-phone direct Bluetooth connectivity extended to 10km, 6.6 times the previous generation's range.
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Support for BeiDou satellite navigation with 33% faster Time to First Fix (TTFF), even without a cellular signal.
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Wi-Fi 7 support with tri-band concurrency and five-stream performance.
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MediaTek Xtra Range 3.0 for up to 30 metres of additional Wi-Fi coverage.
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Dual SIM Dual Active (DSDA) for 5G and 4G, offering simultaneous data use across both networks.