Intel unveils broadwell-based Core M chip for 2-in-1 devices

A number of interesting announcements made by Renée James, President of Intel. Intel announced a 14nm fanless mobile chip family named Core M at Computex and the company also told that the scope of the ‘Internet of Things' is predicted to be in the region of 50 billion units by 2020.

The new 4nm fanless mobile chip family named Core M will power upcoming slimline laptops, tablets and in particular 2-in-1 convertible devices. The Core M processor line is based on Intel's upcoming 14nm chip architecture, codenamed Broadwell, which is said to take up around 50% less space inside devices.

The heart of the 14nm processors is under the new Core-M branding. While clock speeds and core counts were not mentioned, the ‘Core' part of the name means that this should be a Broadwell derived component. Intel stated that Core-M would be in the hands of end-users by the holiday season.

Intel claims that Core M devices will offer 20 to 40% performance improvements, while system on chip (SoC) power could be cut by up to 45 percent, producing 60 percent less heat, which allows for fanless design. Also on show were tablets based on the Core-M technology, in the 10W range but also fanless.

Going ahead, Intel showed their RealSENSE camera - a camera with a 60 fps depth map sensor to allow interaction in real time. As part of the RealSENSE ecosystem, Intel is releasing an SDK kit with a camera and offering a $1m prize for the best app created with the device.

In addition to the above mentioned, Intel also did the official launch of the Intel DC P3700, an enterprise SSD for datacenters. The three SSD data centre series comprise the P3500, P3600, and P3700 model lines.