Intel showcases Wi-Max in a chip

At the opening keynote at Intel Developer Forum 2004 India (IDF)
in Bangalore, Pat Gelsinger, CTO, Intel showed a motherboard with Intel's Wi-Max
"first sili-con"-the encapsulation of Wi-Max specification in a
chipset. This is similar to today's Centrino systems that integrate Wi-FI
(802.11b).

Intel expects integrated Wi-Max systems by 2006. Wi-Max is the
next step beyond Wi-Fi: it blankets a large area with high-speed wireless
broadband, creating a fast "metro-area network".

Wi-Max could give India a rapid-deployment last-mile alternative
for broadband deployment, which is why Intel says it could be to broadband what
cellular was to telephony.

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