Taipei, Oct 17
The APAC Intel Developer Forum (IDF), Fall 2007 took off to a
robust start at the Taipei International Convention Center in Taiwan recently.
'Multiply Your Innovation' being the theme of this year's IDF, speakers at
the conference spoke on mobile, ultra-mobile and wireless technologies.
Participants got to learn about how Intel's technologies would enable the
industry to capture new markets and usage model opportunities; and empower the
developer community to create and innovate more effectively. For the nearly
2,700 attendees and 65 companies participating at the event, bloggers had a hay
day with Intel for the first time providing online blogging at the event.
Making his keynote presentation, Anand Chandrasekher, Senior VP
and GM-Mobile Platform Group, Intel said that the need of the hour was to get
various technologies from the 'extreme' to the 'mainstream.' This,
according to him, was possible only through collaborations and partnerships.
Innovation, he said, was the key to making technologies pervasive and diffuse
them into the market.
Chandrasekher also indicated that the focus for his group at
Intel was the developing markets and India posted a huge opportunity as far as
mobility and WiMax was concerned. He said that together with partners Intel
would maximize on this growth opportunity. Anand also said that Intel would come
out with many new products and solutions in 2008, which would be in sync with
the growth in the mobility market space.
Describing the latest trends in mobile computing, Mooly Eden,
Intel VP and GM-Mobility Platforms Group, Intel gave a sneak peek into the
forthcoming Intel platforms for notebooks that promise better performance,
battery life, have a small form factor and provide for 'always on'
connectivity. He also discussed the future of wireless networking connectivity,
including mobile WiMax.
According to Eden, in January 2008, Intel will launch 'Santa
Rosa Refresh,' an update to Intel Centrino processor technology Santa Rosa
Refresh notebook PCs would contain the Mobile Intel 965 Express chipset family,
Intel Next-Gen Wireless-N network connection, Intel 82566MM and 82566MC Gigabit
Network Connection, and optional Intel Turbo memory.
Eden also demonstrated the Montevina processor technology, which
Intel hopes to deliver in mid-2008. Montevina includes the new 45nm high-k Intel
Penryn mobile processor and comes with DDR3 memory support. This will be Intel's
first Centrino processor technology for notebooks to offer integrated Wi-Fi and
WiMax wireless technologies for better wireless broadband access.